Our Technology

 

Electrolytic plating technologyElectrolytic plating technology has been identified by the bumping industry to have the following advantages:

  • High reliability
  • Fine pitch capability
  • Flexible thickness & composition combination
  • Low cost compared to C4 process
  • Capable of high volume through-put


electroplating technology TLMI’s bumping process combines advanced electroplating technology with a reliable and consistent process to deliver the highest quality products to our customers.

 

Wafer Bumping Process

 

Incoming / Pre Clean
 
Sputter
 
Resist Coating
 
Align / Expose
 
Plate
 
Strip
 
Etch, Reflow or Anneal
 
Final Inspection