Solder Bumping

solder bumping

Layout Guidelines

Solder Bumps

1

 Standard Bump Height  100 µm (Available: 15 – 150 µm)

2

 Bump Height Uniformity  ±5% (in die); ±15% (in wfr); ±20% (wfr to wfr)

3

 Bump Pitch  150 µm Standard ( Fine Pitch Available = 25 µm) Bump Height Dependence

4

 Bump Spacing  75 µm Std. (Bump Size Dependence)

5

 Bump to Passivation Overlap  8 µm Per Side Minimum (10 um preferred)

6

 Edge of Bump to Aluminum  7 µm Per Side Minimum

7

 Passivation Opening  20 µm (Bump size Dependence)

8

 Passivation Angle of Slope  > 60 Degrees

9

 Passivation Type  Nitride, OxyNitride, Polyimide

10

 Wafer Edge Exclusion Zone  3 mm

11

 Bump Mask Layout and Procurement  TLMI In-House Capability: Requires GDSII, Stepping Distance, Wafer Map

Bump Specifications

Solder Bumps

1

 Bump Material  Sn/Pb any ratio, Low Alpha, Sn/Ag/Cu, Sn/Ag

2

 Bumping Method   Electroplating

3

 UBM Material Ti/Cu, TiW/Cu, Ti/Cu/Ni, TiW/Cu/Ni, TiW/Au/Ni

4

 UBM Deposition Method  Sputtering, Sputtering/Plating

5

 Bump Shear Strength  > 1.1 gm/mil2 hi-lead, >2.2 gm/mil2 others

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