Our Technology


Electrolytic plating technologyElectrolytic plating technology has been identified by the bumping industry to have the following advantages:

  • High reliability
  • Fine pitch capability
  • Flexible thickness & composition combination
  • Low cost compared to C4 process
  • Capable of high volume through-put

electroplating technology TLMI’s bumping process combines advanced electroplating technology with a reliable and consistent process to deliver the highest quality products to our customers.


Wafer Bumping Process


Incoming / Pre Clean
Resist Coating
Align / Expose
Etch, Reflow or Anneal
Final Inspection