Copper Bumping

copper bumping

Layout Guidelines

Copper Bumps (Solder, Nickel, Gold or Indium Cap)

1

 Bump Height Average  100 um (10 um to 250 um stacked available)

2

 Bump Height Uniformity  ±5% (in die); ±15% (in wafer); ±20% (wfr to wfr)

3

 Bump Pitch  150 um Standard (Bump Height Dependence)

4

 Bump Spacing  75 µm Minimum (Bump Height Dependence)

5

 Bump to Passivation Overlap  8 µm Per Side Minimum (10 um preferred)

6

 Pad to Bump Overlap  7 µm Per Side Minimum

7

 Passivation Opening  5 µm Minimum (Bump size dependence)

8

 Cap Height  2-50um (Before Reflow)

9

 Passivation Angle of Slope  > 60 Degrees

10

 Passivation Type  Nitride, OxyNitride, Polyimide

11

 Passivation Height  0.5-1.8 um

12

 Wafer Edge Exclusion Zone  3 mm

13

 Mask Layout and Procurement  Requires GDSII or ACAD, Stepping Distance Wafer Map

Specifications

Copper Bumps (Solder, Nickel, Gold or Indium Cap)

1

 Bump Height Average  100 um (10 um to 250 um stacked available)

2

 Copper Shear Strength Height  >12 grams/mil2

3

 Voids  <10% of Solder Bump Volume, No Exposed Pad

4

 Missing Bumps  None Outside Exclusion Area

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