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Layout Guidelines |
Copper Bumps (Solder, Nickel, Gold or Indium Cap) |
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1 |
Bump Height Average | 100 um (10 um to 250 um stacked available) |
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2 |
Bump Height Uniformity | ±5% (in die); ±15% (in wafer); ±20% (wfr to wfr) |
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3 |
Bump Pitch | 150 um Standard (Bump Height Dependence) |
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4 |
Bump Spacing | 75 µm Minimum (Bump Height Dependence) |
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5 |
Bump to Passivation Overlap | 8 µm Per Side Minimum (10 um preferred) |
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6 |
Pad to Bump Overlap | 7 µm Per Side Minimum |
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7 |
Passivation Opening | 5 µm Minimum (Bump size dependence) |
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8 |
Cap Height | 2-50um (Before Reflow) |
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9 |
Passivation Angle of Slope | > 60 Degrees |
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10 |
Passivation Type | Nitride, OxyNitride, Polyimide |
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11 |
Passivation Height | 0.5-1.8 um |
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12 |
Wafer Edge Exclusion Zone | 3 mm |
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13 |
Mask Layout and Procurement | Requires GDSII or ACAD, Stepping Distance Wafer Map |
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Specifications |
Copper Bumps (Solder, Nickel, Gold or Indium Cap) |
|
|
1 |
Bump Height Average | 100 um (10 um to 250 um stacked available) |
|
2 |
Copper Shear Strength Height | >12 grams/mil2 |
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3 |
Voids | <10% of Solder Bump Volume, No Exposed Pad |
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4 |
Missing Bumps | None Outside Exclusion Area |