Gold Bumping

gold bumping

Layout Guidelines

Gold Bumps

1

 Bump Height Average  18 µm & 25 µm std. (Capability: 2-50 µm)

2

 Bump Height Uniformity  ±5% (in die); ±10% (in wfr); ±15% (wfr to wfr)

3

 Bump Pitch  50 µm Minimum (bump size dependence)

4

 Bump Spacing  18 µm Minimum (bump height dependence)

5

 Bump to Passivation Overlap  7 µm Per Side Minimum

6

 Edge of Bump to Aluminum  7 µm Per Side Minimum

7

 Passivation Opening  16 µm Minimum

8

 Passivation Angle of Slope  > 60 Degrees

9

 Passivation Type  Nitride, OxyNitride, Polyimide

10

 Passivation Thickness  0.8 – 1.8 um

11

 Wafer Edge Exclusion  3 mm

12

 Bump Mask Layout and Procurement  TLMI In-house Capability: Requires GDSII, Stepping Distance, Wafer Map

 

Bump Specifications

Gold Bumps

1

 Bump Material  99.9+% pure Gold

2

 Bumping Method  Electroplating

3

 UBM Material  WTi 90/10

4

 UBM Deposition Method  Sputtering

5

 Bump Shear Strength  > 5.6g/mil2

6

 Bump Hardness  40 – 70 Vickers (Annealed)

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