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Layout Guidelines |
Solder Bumps |
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1 |
Standard Bump Height | 100 µm (Available: 15 – 150 µm) | ||
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2 |
Bump Height Uniformity | ±5% (in die); ±15% (in wfr); ±20% (wfr to wfr) | ||
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3 |
Bump Pitch | 150 µm Standard ( Fine Pitch Available = 25 µm) Bump Height Dependence | ||
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4 |
Bump Spacing | 75 µm Std. (Bump Size Dependence) | ||
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5 |
Bump to Passivation Overlap | 8 µm Per Side Minimum (10 um preferred) | ||
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6 |
Edge of Bump to Aluminum | 7 µm Per Side Minimum | ||
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7 |
Passivation Opening | 20 µm (Bump size Dependence) | ||
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8 |
Passivation Angle of Slope | > 60 Degrees | ||
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9 |
Passivation Type | Nitride, OxyNitride, Polyimide | ||
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10 |
Wafer Edge Exclusion Zone | 3 mm | ||
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11 |
Bump Mask Layout and Procurement | TLMI In-House Capability: Requires GDSII, Stepping Distance, Wafer Map | ||
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Bump Specifications |
Solder Bumps |
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1 |
Bump Material | Sn/Pb any ratio, Low Alpha, Sn/Ag/Cu, Sn/Ag | ||
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2 |
Bumping Method | Electroplating | ||
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3 |
UBM Material | Ti/Cu, TiW/Cu, Ti/Cu/Ni, TiW/Cu/Ni, TiW/Au/Ni | ||
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4 |
UBM Deposition Method | Sputtering, Sputtering/Plating | ||
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5 |
Bump Shear Strength | > 1.1 gm/mil2 hi-lead, >2.2 gm/mil2 others | ||