|
Layout Guidelines
|
Gold Bumps
|
|
1
|
Bump Height Average |
18 µm & 25 µm std. (Capability: 2-50 µm) |
|
2
|
Bump Height Uniformity |
±5% (in die); ±10% (in wfr); ±15% (wfr to wfr) |
|
3
|
Bump Pitch |
50 µm Minimum (bump size dependence) |
|
4
|
Bump Spacing |
18 µm Minimum (bump height dependence) |
|
5
|
Bump to Passivation Overlap |
7 µm Per Side Minimum |
|
6
|
Edge of Bump to Aluminum |
7 µm Per Side Minimum |
|
7
|
Passivation Opening |
16 µm Minimum |
|
8
|
Passivation Angle of Slope |
> 60 Degrees |
|
9
|
Passivation Type |
Nitride, OxyNitride, Polyimide |
|
10
|
Passivation Thickness |
0.8 – 1.8 um |
|
11
|
Wafer Edge Exclusion |
3 mm |
|
12
|
Bump Mask Layout and Procurement |
TLMI In-house Capability: Requires GDSII, Stepping Distance, Wafer Map |
